MCIMX6U4AVM08ACR OverviewShipping overseas is convenient since the embedded microprocessor is packed in 624-LFBGA. In order to provide high reliability, advanced packaging method Tape & Reel (TR) is used. Cores/Bus width is 2 Core 32-Bit. Recognize operating temperatures around -40°C~125°C TJ. The cpu microprocessor belongs to the i.MX6DL series. The CPU is cored with a ARM® Cortex®-A9 processor. The CPU uses LPDDR2, LVDDR3, DDR3 RAM controllers. This microprocessor features interfaces CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART. In this CPU, I/O is set to 1.8V 2.5V 2.8V 3.3V.
MCIMX6U4AVM08ACR FeaturesARM® Cortex®-A9 Core
MCIMX6U4AVM08ACR ApplicationsThere are a lot of NXP USA Inc.
MCIMX6U4AVM08ACR Microprocessor applications.
Consumer electronics products
Toys
Robots
Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
Factory Lead Time | 15 Weeks |
Package / Case | 624-LFBGA |
Operating Temperature | -40°C~125°C TJ |
Packaging | Tape & Reel (TR) |
Series | i.MX6DL |
Published | 2002 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Speed | 800MHz |
Core Processor | ARM® Cortex®-A9 |
Voltage - I/O | 1.8V 2.5V 2.8V 3.3V |
Ethernet | 10/100/1000Mbps (1) |
Number of Cores/Bus Width | 2 Core 32-Bit |
Graphics Acceleration | Yes |
RAM Controllers | LPDDR2, LVDDR3, DDR3 |
USB | USB 2.0 + PHY (4) |
Additional Interfaces | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Co-Processors/DSP | Multimedia; NEON™ SIMD |
Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
Display & Interface Controllers | Keypad, LCD |
RoHS Status | ROHS3 Compliant |